"OLED Core Process Equipment Supplier” capable of ultra-high-precision control
A Mask based on novel techniques enabling ① large area processing and ②ultra-high resolution; fabricated by assembling a unit mask to an open stick
Ultra-high Resolution (≥800 PPI)
Compatibility (Etching, Laser, EFM)
Large area (8GF, 10.5G) processing possible
Enables implementation of large area (8.5G or larger) and ultra-high resolution (800 ppi or higher) owning to the technical differences
FMM | Hybrid Mask | |
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Technical differences (For 6GH) |
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Strengths |
· Limitations in terms of size · Poor durability and difficulty in handling · Difficulties in controls of width-wise expansion due to two-sided welding · Having to scrap the entire stick in case of defects |
· Large area implementation possible · Excellent durability and ease of handling · Control of deformation by thermal expansion owing to four-sided welding · Allows repairing by unit · Fabrication based on unit mask allowing high compatibility (Etching, Laser, EFM) → Allows strategic cooperation |